Introduction

The rapid growth of AI is transforming data center infrastructure.

As computing workloads become more demanding, traditional air cooling is facing increasing challenges in supporting higher rack power density. Liquid cooling is emerging as a key approach to help data centers achieve higher efficiency, greater scalability, and improved thermal management.

However, liquid cooling is not a one-size-fits-all solution. Different architectures are designed for different application needs.

Today, three major liquid cooling approaches are shaping the future of high-density data centers: Direct-to-Chip Cooling, Immersion Cooling, and Spray Cooling.

Three Liquid Cooling Approaches

 1. Direct-to-Chip Cooling

The mainstream choice for AI and high-density computing

Direct-to-Chip cooling removes heat directly from CPUs and GPUs through cold plates, significantly improving cooling efficiency compared with traditional air cooling.

With a good balance between performance, reliability, and deployment flexibility, it has become one of the most widely adopted liquid cooling solutions for modern AI infrastructure.

Best suited for:
AI servers, HPC systems, and high-density data center environments.

2. Immersion Cooling

Designed for future ultra-high-density computing

Immersion cooling places IT equipment directly into dielectric coolant, enabling highly efficient heat removal without relying on traditional airflow.

While it offers outstanding cooling potential, it also requires changes in server design, maintenance processes, and operational models.

Best suited for:
Extreme-density computing and next-generation AI applications.

3. Spray Cooling

An emerging liquid cooling approach

Spray cooling removes heat by directly applying coolant to high-power components, offering excellent heat transfer performance.

However, due to its limited commercial adoption and higher deployment complexity, spray cooling is currently less widely used in data centers compared with Direct-to-Chip and Immersion Cooling.

Best suited for:
Future high-density computing scenarios requiring advanced thermal management.

Selecting the Right Cooling Architecture

Each liquid cooling technology plays a different role in the evolution of data center cooling:

● Direct-to-Chip cooling provides the most practical solution for today's AI infrastructure, balancing performance, reliability, deployment flexibility, and compatibility with existing systems.

● Immersion cooling supports future ultra-high-density computing with excellent heat transfer capability, higher cooling efficiency, and the potential to improve overall data center energy efficiency.

● Spray cooling represents an emerging approach, with potential for future high-density applications but limited commercial adoption today.

The right choice depends on factors such as rack density, facility conditions, deployment requirements, and long-term growth plans.

KSTAR LiquiX: Enabling Scalable Liquid Cooling for AI Infrastructure

As data centers continue evolving toward higher-density computing, liquid cooling solutions need to deliver greater flexibility, scalability, and deployment efficiency.

KSTAR LiquiX Liquid Cooling Platform is designed to support diverse AI and high-density computing scenarios, with cooling capacities ranging from 10kW to 2MW.

Key capabilities include:

● Prefabricated liquid cooling solutions for faster deployment and simplified installation

● High cooling density to support AI-driven computing demands

● Flexible heat exchange configurations for different application needs

● Compatibility with multiple data center architectures, including KSTAR's IDB, IDM, and IDU modular data center solutions.

With the launch of its latest 600kW CDU, KSTAR continues expanding its liquid cooling series to support the next generation of AI infrastructure.

The future of data centers will require cooling architectures that can evolve together with computing demands. By combining flexibility, scalability, and reliability, liquid cooling will become a critical foundation for next-generation digital infrastructure.